DocumentCode
750619
Title
Fine line circuit manufacturing technology with electroless copper plating
Author
Akahoshi, Haruo ; Kawamoto, Mineo ; Itabashi, Takeyulu ; Miura, Osamu ; Takahashi, Akio ; Kobayashi, Shiro ; Miyazaki, Masashi ; Mutoh, Tsunefumi ; Wajima, Motoyo ; Ishimaru, Toshiaki
Author_Institution
Res. Lab., Hitachi Ltd., Ibaraki, Japan
Volume
18
Issue
1
fYear
1995
fDate
3/1/1995 12:00:00 AM
Firstpage
127
Lastpage
135
Abstract
Two types of additive processes for fine circuit pattern manufacturing technology using electroless copper plating have been developed. The processes offer high dimensional accuracy. Technical aspects of the additive processes, materials for the fabrication of additive circuits, and the performance of these circuits are reported here
Keywords
adhesion; copper; electroless deposition; etching; fine-pitch technology; multichip modules; photolithography; printed circuit manufacture; thin film circuits; Cu; additive processes; electroless Cu plating; fabrication; fine circuit patterning; fine line circuit manufacturing technology; high-density circuits; Additives; Adhesives; Chemical technology; Circuits; Copper; Etching; Laminates; Manufacturing; Resists; Wiring;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.370746
Filename
370746
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