• DocumentCode
    750749
  • Title

    Simulations and measurements of picosecond signal transients, propagation, and crosstalk on lossy VLSI interconnect

  • Author

    Eo, Yungseon ; Eisenstadt, William R.

  • Author_Institution
    VLSI TCAD Group, Florida Univ., Gainesville, FL, USA
  • Volume
    18
  • Issue
    1
  • fYear
    1995
  • fDate
    3/1/1995 12:00:00 AM
  • Firstpage
    215
  • Lastpage
    225
  • Abstract
    Signal transients, propagation, and crosstalk simulations of coupled interconnect lines have been performed, and the results verified by time-domain measurements. These simulations include frequency dependent interconnect circuit parameters, arbitrary loads, and 30 ps rise times. A generalized interconnect transfer function is used to calculate circuit responses in the frequency domain. Then an inverse Fourier transform is employed to predict the time-domain signals. Frequency variant TC interconnect models and PISCES-II simulations are used to determine the interconnect circuit model parameters. The simulation results are compared with conventional interconnect circuit models such as LC, RC, and RLC networks. Time-domain interconnect measurements using a HP54121T sampling oscilloscope show excellent agreement with simulations. Thus, signal transients, propagation, and coupling noise of on-chip interconnects are predicted
  • Keywords
    Fourier transforms; VLSI; circuit analysis computing; coupled circuits; crosstalk; distributed parameter networks; integrated circuit interconnections; network parameters; time-domain analysis; transfer function matrices; transient analysis; PISCES-II simulations; arbitrary loads; circuit responses; coupled interconnect lines; crosstalk; frequency dependent circuit parameters; frequency domain; generalized interconnect transfer function; interconnect circuit model parameters; inverse Fourier transform; lossy VLSI interconnect; onchip interconnects; picosecond signal transients; propagation; ps rise times; time-domain measurements; time-domain signals; Circuit simulation; Coupling circuits; Crosstalk; Frequency dependence; Frequency domain analysis; Integrated circuit interconnections; Performance evaluation; RLC circuits; Time domain analysis; Transfer functions;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.370758
  • Filename
    370758