• DocumentCode
    750837
  • Title

    Assembly and Electrical Characterization of Multiwall Carbon Nanotube Interconnects

  • Author

    Close, Gael F. ; Wong, H-S Philip

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., Stanford, CA
  • Volume
    7
  • Issue
    5
  • fYear
    2008
  • Firstpage
    596
  • Lastpage
    600
  • Abstract
    We demonstrate a general method to assemble and contact arrays of individual multiwall carbon nanotube (MWCNT) interconnects between electrodes in one batch. We have also collected about 200 resistance measurements to compare four different contact metals: Al, Au, Ti, and Pd. We have also measured the radio frequency characteristics of the assembled MWCNTs up to 15 GHz. High-resolution transmission electron microscopy analysis has been used to correlate the electrical and physical characteristics of the MWCNTs.
  • Keywords
    aluminium; carbon nanotubes; contact resistance; gold; integrated circuit interconnections; palladium; titanium; transmission electron microscopy; Al; Au; C; Pd; Ti; electrodes; high-resolution transmission electron microscopy; multiwall carbon nanotube interconnects; radio frequency characteristics; Carbon Nanotube; Carbon nanotube; Interconnects; Nano-fabrication; Nanoelectronics; interconnects; nanoelectronics; nanofabrication;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1536-125X
  • Type

    jour

  • DOI
    10.1109/TNANO.2008.927373
  • Filename
    4542976
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=750837