DocumentCode :
751289
Title :
Improvement of RCA transistor using RTA annealing after the formation of interfacial oxide
Author :
Chun, Zhang Li ; Yan, Jin Hai ; Fei, Ye Hong ; Zhi, Gao Yu ; Jun, Ning Bao ; Xian, Mo Bang
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Volume :
49
Issue :
6
fYear :
2002
fDate :
6/1/2002 12:00:00 AM
Firstpage :
1075
Lastpage :
1076
Abstract :
A polysilicon emitter RCA transistor (an ultra-thin interfacial oxide layer exists between polysilicon and silicon emitter) is presented which can operate at 77 K for the first time. An ultra-thin (1.5 nm) interfacial oxide layer is grown deliberately between polysilicon and silicon emitter using RCA oxidation and excellent device stability is obtained after rapid thermal annealing (RTA) treatment in nitrogen atmosphere. The RCA transistor exhibits good electrical performance at very low temperature for an emitter area of 3 × 8 μm2. The maximum toggle frequency of a 1:2 static divider is 1.2 GHz and 732 MHz at 300 K and 77 K, respectively
Keywords :
bipolar transistors; cryogenic electronics; elemental semiconductors; oxidation; rapid thermal annealing; silicon; surface cleaning; 1.5 nm; 77 K; RCA oxidation; RCA transistor; Si; current gain; device stability; polysilicon emitter transistor; rapid thermal annealing; surface cleaning; toggle frequency; ultrathin interfacial oxide layer; Atmosphere; Bipolar transistors; Etching; Hafnium; Oxidation; Rapid thermal annealing; Silicon; Surface cleaning; Temperature; Thermal stability;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2002.1003751
Filename :
1003751
Link To Document :
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