Title :
Surface- and bulk- micromachined two-dimensional scanner driven by angular vertical comb actuators
Author :
Piyawattanametha, Wibool ; Patterson, Pamela R. ; Hah, Dooyoung ; Toshiyoshi, Hiroshi ; Wu, Ming C.
Author_Institution :
Dept. of Electr. Eng., Univ. of California, Los Angeles, CA, USA
Abstract :
In this paper, we present the design, fabrication, and measurements of a two-dimensional (2-D) optical scanner with electrostatic angular vertical comb (AVC) actuators. The scanner is realized by combining a foundry-based surface-micromachining process (Multi-User MEMS Processes-MUMPs) with a three-mask deep-reactive ion-etching (DRIE) postfabrication process. The surface-micromachining provides versatile mechanical design and electrical interconnect while the bulk micromachining offers high-aspect ratio structures leading to flat mirrors and high-force, large-displacement actuators. The scanner achieves dc mechanical scanning ranges of ±6.2° (at 55 Vdc) and ±4.1° (at 50 Vdc) for the inner and outer gimbals, respectively. The resonant frequencies are 315 and 144 Hz for the inner and the outer axes, respectively. The 1-mm-diameter mirror has a radius of curvature of over 50 cm. [1454].
Keywords :
electrostatic actuators; micromachining; micromirrors; optical scanners; sputter etching; 1 mm; 144 Hz; 2D optical scanner; 315 Hz; angular vertical comb actuators; bulk micromachining; deep reactive ion etching; electrical interconnect; electrostatic force actuators; laser beam steering; micromirror; multiuser MEMS processes; optical coherence tomography; surface micromachining; Automatic voltage control; Electrostatic actuators; Electrostatic measurements; Micromachining; Micromechanical devices; Mirrors; Optical design; Optical device fabrication; Optical interconnections; Two dimensional displays; Angular vertical comb (AVC) actuators; confocal microscopy two-dimensional (2-D) scanner; electrostatic force actuators; laser beam steering; micromirror; optical coherence tomography (OCT); scanner;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2005.859073