• DocumentCode
    751508
  • Title

    Optimizing fiber coupling with a quasi-passive microoptical bench

  • Author

    Li, Biao ; Wirz, Holger ; Sharon, Andre

  • Author_Institution
    Fraunhofer Center for Manuf. Innovation, Brookline, MA, USA
  • Volume
    14
  • Issue
    6
  • fYear
    2005
  • Firstpage
    1339
  • Lastpage
    1346
  • Abstract
    While the silicon microoptical bench with purely passive locational features was an attempt at breadboard-like integration for photonic applications, it failed to provide the high-precision alignment required for efficient light coupling between devices and/or fibers. To optimize the final alignment without the introduction of on-board active actuators or external high-precision manipulators, we have developed and demonstrated a low-cost, micromachined optical bench with quasipassive locational features capable of submicron alignment optimization. The concept capitalizes on inherent residual tensile stresses produced during the stoichiometric Si3N4 thin-film deposition process. By selectively trimming stress element on either side of a suspended platform, the equilibrium position can be biased to one side or another, enabling high-resolution relative motion between the suspended platform and the base. We have demonstrated, as a first attempt, high-efficiency fiber-to-fiber alignment using this concept. [1556].
  • Keywords
    micro-optics; micromachining; optical fibre couplers; silicon compounds; Si3N4; fiber coupling; laser trimming; light coupling; manipulators; micromachining; on board active actuators; photonic applications; silicon microoptical bench; stoichiometric silicon nitride film; submicron alignment optimization; thin film deposition process; Optical coupling; Optical fiber devices; Optical fibers; Optical films; Optical filters; Optical materials; Optical receivers; Packaging; Semiconductor materials; Silicon; Fiber coupling; laser trimming; microoptical bench; nanoscale motion; residual stress; stoichiometric silicon nitride film;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2005.859091
  • Filename
    1549868