Title :
Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications
Author :
Jacobsen, John Bjerregaard ; Krog, Jens Peter ; Rimestad, Lars ; Riis, Annemette ; Holm, Allan Hjarbaek
Author_Institution :
Dept. 3820 R&T, GRUNDFOS A/S, Bjerringbro, Denmark
Abstract :
More and more electronics are being used in climatically harsh environments. Therefore, the challenge of designing climate-protective packaging continues to increase. Still, relatively little is known among design engineers about how to design for robustness and how to model and predict the lifetime of electronics in moist environments and, in particular, in condensing applications.
Keywords :
design engineering; electronics packaging; moisture; physics; climate-protective packaging; climatic challenge; climatically harsh environment; condensing application; design engineer; electronics; physics; Atmospheric measurements; Design methodology; Electronics; Meteorology; Packaging;
Journal_Title :
Industrial Electronics Magazine, IEEE
DOI :
10.1109/MIE.2014.2330912
