DocumentCode
75151
Title
Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications
Author
Jacobsen, John Bjerregaard ; Krog, Jens Peter ; Rimestad, Lars ; Riis, Annemette ; Holm, Allan Hjarbaek
Author_Institution
Dept. 3820 R&T, GRUNDFOS A/S, Bjerringbro, Denmark
Volume
8
Issue
3
fYear
2014
fDate
Sept. 2014
Firstpage
51
Lastpage
59
Abstract
More and more electronics are being used in climatically harsh environments. Therefore, the challenge of designing climate-protective packaging continues to increase. Still, relatively little is known among design engineers about how to design for robustness and how to model and predict the lifetime of electronics in moist environments and, in particular, in condensing applications.
Keywords
design engineering; electronics packaging; moisture; physics; climate-protective packaging; climatic challenge; climatically harsh environment; condensing application; design engineer; electronics; physics; Atmospheric measurements; Design methodology; Electronics; Meteorology; Packaging;
fLanguage
English
Journal_Title
Industrial Electronics Magazine, IEEE
Publisher
ieee
ISSN
1932-4529
Type
jour
DOI
10.1109/MIE.2014.2330912
Filename
6901304
Link To Document