DocumentCode :
751691
Title :
Effects of Measurement Temperature on NBTI
Author :
Zhang, J.F. ; Chang, M.H. ; Groeseneken, G.
Author_Institution :
Sch. of Eng., Liverpool John Moores Univ.
Volume :
28
Issue :
4
fYear :
2007
fDate :
4/1/2007 12:00:00 AM
Firstpage :
298
Lastpage :
300
Abstract :
Negative bias temperature instability (NBTI) is a pressing reliability issue for the CMOS industry. NBTI has been measured at stress temperature in most of the recent works. For the first time, this letter will demonstrate that, for a given number of defects, the threshold-voltage shift measured at stress temperature can be less than half of its value at room temperature. As a result, the data obtained at different measurement temperatures should not be used for extracting the thermal enhancement of defect creation. In the future, this newly identified dependence on measurement temperature should be taken into account when estimating the NBTI limited lifetime of pMOSFETs
Keywords :
MOSFET; semiconductor device reliability; temperature; CMOS industry; NBTI; defect creation; gate dielectric; measurement temperature effect; negative bias temperature instability; reliability issue; stress temperature; thermal enhancement; Data mining; Negative bias temperature instability; Niobium compounds; Pressing; Stress measurement; Temperature dependence; Temperature measurement; Thermal stresses; Time measurement; Titanium compounds; Bias temperature instability (BTI); defects; degradation; gate dielectric; lifetime; negative BTI (NBTI); oxynitrides;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2007.893219
Filename :
4137653
Link To Document :
بازگشت