DocumentCode
753430
Title
Plasma impedance in a narrow gap capacitively coupled RF discharge
Author
Bera, Kallol ; Chen, Chen-An ; Vitello, Peter
Author_Institution
Appl. Mater. Inc., Santa Clara, CA, USA
Volume
30
Issue
1
fYear
2002
fDate
2/1/2002 12:00:00 AM
Firstpage
144
Lastpage
145
Abstract
Capacitively coupled reactors with narrow gap spacings are extensively used for plasma enhanced chemical vapor deposition (PECVD) processes in the semiconductor industry. An understanding of the plasma impedance is important for efficient coupling of the source power to the plasma. The plasma impedance can change based on operating conditions as the structure of the discharge changes. The plasma impedance and power requirement are calculated for different RF potential. Images of the electron density distribution, and the electron and ion density profiles in the well-resolved sheath are also presented to provide better insight of the plasma behavior
Keywords
electron density; high-frequency discharges; plasma CVD; plasma density; plasma sheaths; semiconductor technology; RF potential; capacitively coupled reactors; electron density distribution; electron density profiles; ion density profiles; narrow gap capacitively coupled RF discharge; narrow gap spacings; plasma behavior; plasma enhanced chemical vapor position; plasma impedance; semiconductor industry; sheath; Electrons; Fault location; Impedance; Inductors; Plasma applications; Plasma chemistry; Plasma density; Plasma sheaths; Plasma sources; Radio frequency;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/TPS.2002.1003965
Filename
1003965
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