• DocumentCode
    753430
  • Title

    Plasma impedance in a narrow gap capacitively coupled RF discharge

  • Author

    Bera, Kallol ; Chen, Chen-An ; Vitello, Peter

  • Author_Institution
    Appl. Mater. Inc., Santa Clara, CA, USA
  • Volume
    30
  • Issue
    1
  • fYear
    2002
  • fDate
    2/1/2002 12:00:00 AM
  • Firstpage
    144
  • Lastpage
    145
  • Abstract
    Capacitively coupled reactors with narrow gap spacings are extensively used for plasma enhanced chemical vapor deposition (PECVD) processes in the semiconductor industry. An understanding of the plasma impedance is important for efficient coupling of the source power to the plasma. The plasma impedance can change based on operating conditions as the structure of the discharge changes. The plasma impedance and power requirement are calculated for different RF potential. Images of the electron density distribution, and the electron and ion density profiles in the well-resolved sheath are also presented to provide better insight of the plasma behavior
  • Keywords
    electron density; high-frequency discharges; plasma CVD; plasma density; plasma sheaths; semiconductor technology; RF potential; capacitively coupled reactors; electron density distribution; electron density profiles; ion density profiles; narrow gap capacitively coupled RF discharge; narrow gap spacings; plasma behavior; plasma enhanced chemical vapor position; plasma impedance; semiconductor industry; sheath; Electrons; Fault location; Impedance; Inductors; Plasma applications; Plasma chemistry; Plasma density; Plasma sheaths; Plasma sources; Radio frequency;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2002.1003965
  • Filename
    1003965