DocumentCode
754152
Title
Gate-all-around MOSFETs: lateral ultra-narrow (≤10 nm) fin as channel body
Author
Singh, N. ; Agarwal, A. ; Bera, L.K. ; Kumar, R. ; Lo, G.Q. ; Narayanan, B. ; Kwong, D.L.
Author_Institution
Inst. of Microelectron., Singapore
Volume
41
Issue
24
fYear
2005
Firstpage
1353
Lastpage
1354
Abstract
The fabrication of lateral ultra-narrow fin body (thickness ≤10 nm) gate-all-around MOSFETs, which exhibit excellent gate electrostatic control over the channel, is presented. The narrow fins were formed using alternating phase DUV lithography and low temperature oxidation of Si. The device characteristics are completely free from substrate bias effects.
Keywords
MOSFET; silicon; ultraviolet lithography; DUV lithography; Si; gate electrostatic control; gate-all-around MOSFET; lateral ultra-narrow fin body; low temperature oxidation; substrate bias effect;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20053195
Filename
1550132
Link To Document