• DocumentCode
    754230
  • Title

    Analysis of substrate coupling by means of a stochastic method

  • Author

    Maffezzoni, Paolo ; Maffezzoni, Paolo

  • Author_Institution
    Dipt. di Elettronica e Informazione, Politecnico di Milano, Italy
  • Volume
    23
  • Issue
    6
  • fYear
    2002
  • fDate
    6/1/2002 12:00:00 AM
  • Firstpage
    351
  • Lastpage
    353
  • Abstract
    The paper addresses the problem of modeling the coupling effects that take place in resistive IC substrates for accurate and efficient circuit analysis. The proposed method is based on a suited extension of the floating random walk algorithm that can deal with mixed Dirichlet and Neumann boundary conditions.
  • Keywords
    integrated circuit modelling; stochastic processes; substrates; floating random walk algorithm; mixed Dirichlet/Neumann boundary conditions; modeling; resistive IC substrates; stochastic method; substrate coupling; Boundary conditions; Conductivity; Contacts; Coupling circuits; Electric potential; Electrostatics; Geometry; Green function; Stochastic processes; Surface resistance;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2002.1004232
  • Filename
    1004232
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=754230