DocumentCode :
754230
Title :
Analysis of substrate coupling by means of a stochastic method
Author :
Maffezzoni, Paolo ; Maffezzoni, Paolo
Author_Institution :
Dipt. di Elettronica e Informazione, Politecnico di Milano, Italy
Volume :
23
Issue :
6
fYear :
2002
fDate :
6/1/2002 12:00:00 AM
Firstpage :
351
Lastpage :
353
Abstract :
The paper addresses the problem of modeling the coupling effects that take place in resistive IC substrates for accurate and efficient circuit analysis. The proposed method is based on a suited extension of the floating random walk algorithm that can deal with mixed Dirichlet and Neumann boundary conditions.
Keywords :
integrated circuit modelling; stochastic processes; substrates; floating random walk algorithm; mixed Dirichlet/Neumann boundary conditions; modeling; resistive IC substrates; stochastic method; substrate coupling; Boundary conditions; Conductivity; Contacts; Coupling circuits; Electric potential; Electrostatics; Geometry; Green function; Stochastic processes; Surface resistance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2002.1004232
Filename :
1004232
Link To Document :
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