DocumentCode
75428
Title
A 3-D Near-Field Modeling Approach for Electromagnetic Interference Prediction
Author
Shall, H. ; Riah, Z. ; Kadi, Moncef
Author_Institution
Res. Inst. for Embedded Syst., St. Étienne du Rouvray, France
Volume
56
Issue
1
fYear
2014
fDate
Feb. 2014
Firstpage
102
Lastpage
112
Abstract
This paper presents, through an illustrative example, a 3-D modeling approach to predict the electromagnetic interference (EMI) between complex electronic devices and interconnections placed in the near-field region. Three different analytic coupling formulations have been investigated along with a 3-D-emission model to evaluate the induced voltages in transmission line (TL) extremities in the case of both matched and mismatched TL configurations. The proposed modeling method is successfully validated by comparison with numerical results using electromagnetic (EM) simulation tools and experimental results using near-field measurement. The obtained EM coupling results are more accurate than other traditional 2-D models.
Keywords
electromagnetic interference; electronic engineering computing; solid modelling; transmission lines; 3D near-field modeling approach; 3D-emission model; EM coupling results; EMI; complex electronic devices; complex interconnections; electromagnetic interference prediction; electromagnetic simulation tools; induced voltage evaluation; matched TL configurations; mismatched TL configurations; near-field measurement; transmission line; Antenna measurements; Couplings; Integrated circuit modeling; Numerical models; Probes; Solid modeling; Transmission line measurements; 3-D-emission model; Analytic coupling formulations; near-field measurement; transmission lines (TL);
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2013.2274576
Filename
6576152
Link To Document