• DocumentCode
    75428
  • Title

    A 3-D Near-Field Modeling Approach for Electromagnetic Interference Prediction

  • Author

    Shall, H. ; Riah, Z. ; Kadi, Moncef

  • Author_Institution
    Res. Inst. for Embedded Syst., St. Étienne du Rouvray, France
  • Volume
    56
  • Issue
    1
  • fYear
    2014
  • fDate
    Feb. 2014
  • Firstpage
    102
  • Lastpage
    112
  • Abstract
    This paper presents, through an illustrative example, a 3-D modeling approach to predict the electromagnetic interference (EMI) between complex electronic devices and interconnections placed in the near-field region. Three different analytic coupling formulations have been investigated along with a 3-D-emission model to evaluate the induced voltages in transmission line (TL) extremities in the case of both matched and mismatched TL configurations. The proposed modeling method is successfully validated by comparison with numerical results using electromagnetic (EM) simulation tools and experimental results using near-field measurement. The obtained EM coupling results are more accurate than other traditional 2-D models.
  • Keywords
    electromagnetic interference; electronic engineering computing; solid modelling; transmission lines; 3D near-field modeling approach; 3D-emission model; EM coupling results; EMI; complex electronic devices; complex interconnections; electromagnetic interference prediction; electromagnetic simulation tools; induced voltage evaluation; matched TL configurations; mismatched TL configurations; near-field measurement; transmission line; Antenna measurements; Couplings; Integrated circuit modeling; Numerical models; Probes; Solid modeling; Transmission line measurements; 3-D-emission model; Analytic coupling formulations; near-field measurement; transmission lines (TL);
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2013.2274576
  • Filename
    6576152