DocumentCode :
754687
Title :
Engineering Your Future [Schoch´s Review]
Author :
Walesh, Stuart G.
Volume :
12
Issue :
1
fYear :
1996
Firstpage :
41
Keywords :
Books; Chip scale packaging; Electronics packaging; Engineering management; Engineering profession; Ethics; Humans; Management training; Manufacturing; Writing;
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.1996.484114
Filename :
484114
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=754687
