Title :
Low-Power Test Data Application in EDT Environment Through Decompressor Freeze
Author :
Czysz, Dariusz ; Mrugalski, Grzegorz ; Rajski, Janusz ; Tyszer, Jerzy
Author_Institution :
Fac. of Electron. & Telecommun., Poznan Univ. of Technol., Poznan
fDate :
7/1/2008 12:00:00 AM
Abstract :
This paper presents a new low-power test scheme integrated with the embedded deterministic test environment. The key contribution of this paper is a flexible test cube encoding scheme, which, in conjunction with a continuous flow decompressor, allows one to significantly reduce toggling rates when test patterns are fed into scan chains. The proposed solution requires neither additional design for testability logic nor modifications to the circuit under test. Experimental results obtained for industrial designs indicate that using this nonintrusive technique reduces switching activity to such extent that the resultant scan-in power consumption is similar to that of the functional mode, thus alleviating problems that are related to average and peak power dissipation, overheating, and risk of reliability degradation. Our approach seamlessly integrates with test logic synthesis flow, and it does not compromise compression ratios. Moreover, it fits well into various design paradigms, including modular design flow where modules come with individual decompressors and compactors.
Keywords :
circuit reliability; circuit testing; design for testability; power consumption; EDT environment; circuit under test; decompressor freeze; embedded deterministic test environment; low-power test data application; nonintrusive technique; reliability degradation risk; resultant scan-in power consumption; toggling rates; Automatic test pattern generation; Circuit testing; Degradation; Design for testability; Encoding; Energy consumption; Logic design; Logic testing; Power dissipation; Test pattern generators; Embedded deterministic test (EDT); low-power decompression; scan-based testing; test data compression;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.2008.923111