A novel structure to realize crack-free plastic package during reflow soldering process-development of Chip Side-Support (CSS) package

Author

Nakazawa, Tsutomu ; Inoue, Yumi ; Sawada, Kanako ; Sudo, Toshio

Author_Institution

Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan

Volume

19

Issue

1

fYear

1996

fDate

1/1/1996 12:00:00 AM

Firstpage

61

Lastpage

69

Abstract

A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of 0.45 mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of a crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin

Keywords

cracks; deformation; integrated circuit packaging; lead bonding; plastic packaging; reflow soldering; shear strength; stress effects; 240 C; chip side support package; crack-free plastic package; design criteria; mold resin; reflow soldering process; shear strength; shear stress; Adhesives; Bonding; Cascading style sheets; Delamination; Equations; Moisture; Plastic packaging; Reflow soldering; Resins; Thermal stresses;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Publisher

ieee

ISSN

1083-4400

Type

jour

DOI

10.1109/3476.484206

Filename

484206