DocumentCode :
755580
Title :
The "millipede" - nanotechnology entering data storage
Author :
Vettiger, P. ; Cross, G. ; Despont, M. ; Drechsler, U. ; Dürig, U. ; Gotsmann, B. ; Häberle, W. ; Lantz, M.A. ; Rothuizen, H.E. ; Stutz, R. ; Binnig, G.K.
Author_Institution :
Zurich Res. Lab., IBM Res., Ruschlikon, Switzerland
Volume :
1
Issue :
1
fYear :
2002
fDate :
3/1/2002 12:00:00 AM
Firstpage :
39
Lastpage :
55
Abstract :
Present a new scanning-probe-based data-storage concept called the "millipede" that combines ultrahigh density, terabit capacity, small form factor, and high data rate. Ultrahigh storage density has been demonstrated by a new thermomechanical local-probe technique to store, read back, and erase data in very thin polymer films. With this new technique, nanometer-sized bit indentations and pitch sizes have been made by a single cantilever/tip into thin polymer layers, resulting in a data storage densities of up to 1 Tb/in2. High data rates are achieved by parallel operation of large two-dimensional (2-D) atomic force microscope (AFM) arrays that have been batch-fabricated by silicon surface-micromachining techniques. The very large-scale integration (VLSI) of micro/nanomechanical devices (cantilevers/tips) on a single chip leads to the largest and densest 2-D array of 32×32 (1024) AFM cantilevers with integrated write/read/erase storage functionality ever built. Time-multiplexed electronics control the functional storage cycles for parallel operation of the millipede array chip. Initial areal densities of 100-200 Gb/in2 have been achieved with the 32×32 array chip
Keywords :
VLSI; atomic force microscopy; integrated memory circuits; micromachining; nanotechnology; polymer films; VLSI; areal densities; atomic force microscope arrays; form factor; integrated write/read/erase storage functionality; millipede; nanomechanical devices; nanometer-sized bit indentations; nanotechnology; pitch sizes; polymer films; scanning-probe-based data-storage concept; surface-micromachining techniques; terabit capacity; thermomechanical local-probe technique; time-multiplexed electronics; Atomic force microscopy; Atomic layer deposition; Large scale integration; Memory; Nanotechnology; Polymer films; Silicon; Thermomechanical processes; Two dimensional displays; Very large scale integration;
fLanguage :
English
Journal_Title :
Nanotechnology, IEEE Transactions on
Publisher :
ieee
ISSN :
1536-125X
Type :
jour
DOI :
10.1109/TNANO.2002.1005425
Filename :
1005425
Link To Document :
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