DocumentCode :
755806
Title :
Efficient light scattering modeling for alignment, metrology, and resist exposure in photolithography
Author :
Yuan, Chi-Min
Author_Institution :
IBM East Fishkill Facility, Hopewell Junction, NY, USA
Volume :
39
Issue :
7
fYear :
1992
fDate :
7/1/1992 12:00:00 AM
Firstpage :
1588
Lastpage :
1598
Abstract :
In previous work, a two-dimensional waveguide model has been developed and examined extensively so that rigorous light scattering calculations for photolithography-related processes, such as stepper alignment, linewidth and overlay measurements, and resist bleaching, can be performed. The computation, however, is expensive if the wafer topography involved is complicated or if resist bleaching problems are involved. Numerical techniques that reduce CPU usage by approximately an order of magnitude are reported. These techniques make the waveguide model more practical to use. Typically, for each polarization state, it takes 10 to 200 s to simulate a static case (e.g. linewidth measurement), and it is projected that it will take 7 to 70 min to simulate a dynamic case (e.g. resist bleaching under 13 incoherent illumination point sources and ten exposure steps) on a high-speed workstation such as an IBM RISC/6000 Model 530
Keywords :
light scattering; photolithography; GaAs; III-V semiconductors; alignment; dynamic case; high-speed workstation; incoherent illumination point sources; light scattering calculations; linewidth; linewidth measurement; metrology; overlay measurements; photolithography; resist bleaching; resist exposure; static case; stepper alignment; wafer topography; Bleaching; Light scattering; Lighting; Metrology; Performance evaluation; Polarization; Resists; Semiconductor device modeling; Surfaces; Workstations;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.141223
Filename :
141223
Link To Document :
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