DocumentCode
755867
Title
Guest Editorial
Author
Tomaki, Y.
Volume
9
Issue
1
fYear
1996
Firstpage
1
Keywords
Capacitance; Circuit testing; Electric variables measurement; Failure analysis; Grain boundaries; Integrated circuit interconnections; Materials reliability; Materials testing; Microelectronics; Process control;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.1996.484275
Filename
484275
Link To Document