DocumentCode :
75605
Title :
A Unified Physical-Based Model of Series Resistance of Polycrystalline Silicon Thin-Film Transistors With Explicit Analytical Solutions
Author :
Mingxiang Wang ; Ronghua He ; Dongli Zhang
Author_Institution :
Dept. of Microelectron., Soochow Univ., Suzhou, China
Volume :
60
Issue :
9
fYear :
2013
fDate :
Sept. 2013
Firstpage :
2827
Lastpage :
2833
Abstract :
A physical-based analytical series resistance (Rs) model is first proposed to accurately evaluate the Rs of polycrystalline silicon thin-film transistors (TFTs). Through carefully analyzing the gate-to-source/drain overlap regions, three underlying physical effects wherein are adequately included, namely the gate (Vg)-induced carrier accumulation, current path spreading, and carrier transport via thermionic emission over grain boundaries. The proposed model can precisely reproduce the Vg dependent Rs behavior and fit the experimental data of both metal-induced lateral crystallized and excimer laser annealed TFTs. Furthermore, an explicit analytical expression of Rs is derived using appropriate approximation, based on which all underlying Rs components and their dependencies on device parameters can be clarified. Finally, feasible approaches of Rs reduction are suggested.
Keywords :
approximation theory; carrier density; carrier mobility; electric resistance; elemental semiconductors; semiconductor device models; silicon; thermionic emission; thin film transistors; Si; carrier transport; current path spreading; device parameters; excimer laser annealed TFT; gate induced carrier accumulation; gate-to-source-drain overlap regions; grain boundaries; metal-induced lateral crystallized TFT; physical-based analytical series resistance model; polycrystalline silicon TFT; series resistance reduction; thermionic emission; thin-film transistors; Analytical models; Conductivity; Logic gates; Resistance; Semiconductor device modeling; Semiconductor process modeling; Thin film transistors; Poly-Si; series resistance; thin-film transistors (TFTs);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2274459
Filename :
6576169
Link To Document :
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