• DocumentCode
    756175
  • Title

    Breakdown voltage of field plate and field-limiting ring techniques: numerical comparison

  • Author

    Goud, C. Basavana ; Bhat, K.N.

  • Author_Institution
    Dept. of Electr. Eng., Indian Inst. of Technol., Madras, India
  • Volume
    39
  • Issue
    7
  • fYear
    1992
  • fDate
    7/1/1992 12:00:00 AM
  • Firstpage
    1768
  • Lastpage
    1770
  • Abstract
    Using the recently developed two-dimensional simulator STAAB, the breakdown voltage of the field plate and field-limiting ring junction termination techniques is numerically compared for various values of junction depth, lateral width, and oxide fixed charge. The computed results demonstrate the superiority of the field plate technique over the field-limiting ring technique for planar shallow-junction high-voltage devices, both discrete and integrated
  • Keywords
    digital simulation; electric breakdown of solids; monolithic integrated circuits; semiconductor devices; semiconductor junctions; 2D simulator; STAAB; field plate; field-limiting ring; high-voltage devices; junction depth; junction termination techniques; lateral width; oxide fixed charge; planar shallow-junction; two-dimensional simulator; Computational modeling; Contacts; Councils; Dielectrics; Doping profiles; Ionization; Meteorological radar; Permittivity;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.141246
  • Filename
    141246