DocumentCode
756175
Title
Breakdown voltage of field plate and field-limiting ring techniques: numerical comparison
Author
Goud, C. Basavana ; Bhat, K.N.
Author_Institution
Dept. of Electr. Eng., Indian Inst. of Technol., Madras, India
Volume
39
Issue
7
fYear
1992
fDate
7/1/1992 12:00:00 AM
Firstpage
1768
Lastpage
1770
Abstract
Using the recently developed two-dimensional simulator STAAB, the breakdown voltage of the field plate and field-limiting ring junction termination techniques is numerically compared for various values of junction depth, lateral width, and oxide fixed charge. The computed results demonstrate the superiority of the field plate technique over the field-limiting ring technique for planar shallow-junction high-voltage devices, both discrete and integrated
Keywords
digital simulation; electric breakdown of solids; monolithic integrated circuits; semiconductor devices; semiconductor junctions; 2D simulator; STAAB; field plate; field-limiting ring; high-voltage devices; junction depth; junction termination techniques; lateral width; oxide fixed charge; planar shallow-junction; two-dimensional simulator; Computational modeling; Contacts; Councils; Dielectrics; Doping profiles; Ionization; Meteorological radar; Permittivity;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.141246
Filename
141246
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