• DocumentCode
    756320
  • Title

    A new, high-voltage 4H-SiC lateral dual sidewall Schottky (LDSS) rectifier: theoretical investigation and analysis

  • Author

    Kumar, M. Jagadesh ; Reddy, C. Linga

  • Author_Institution
    Dept. of Electr. Eng., Indian Inst. of Technol., New Delhi, India
  • Volume
    50
  • Issue
    7
  • fYear
    2003
  • fDate
    7/1/2003 12:00:00 AM
  • Firstpage
    1690
  • Lastpage
    1693
  • Abstract
    In this paper, we report a new 4 H-silicon carbide (SiC) lateral dual sidewall Schottky (LDSS) rectifier on a highly doped drift layer consisting of a high-barrier sidewall Schottky contact on top of the low-barrier Schottky contact. Using two-dimensional (2-D) device simulation, the performance of the proposed device has been evaluated in detail by comparing its characteristics with those of the compatible lateral conventional Schottky (LCS) and lateral trench sidewall Schottky (LTSS) rectifiers on 4H-SiC. From our simulation results, it is observed that the proposed LDSS rectifier acts as a low-barrier LTSS rectifier under forward-bias conditions, and as a high-barrier LTSS rectifier under reverse-bias conditions, making it an ideal rectifier. The LDSS rectifier exhibits an on/off current ratio (at 1 V/-500 V) of 5.5×107 for an epitaxial layer doping of 1×1017 /cm3. Further, the proposed LDSS structure exhibits a very sharp breakdown similar to that of a p-i-n diode in spite of using only Schottky junctions in the structure. We have analyzed the reasons for the improved performance of the LDSS.
  • Keywords
    Schottky diodes; power semiconductor diodes; semiconductor device breakdown; silicon compounds; solid-state rectifiers; wide band gap semiconductors; SiC; breakdown voltage; epitaxial layer doping; high-voltage 4H-SiC lateral dual sidewall Schottky rectifier; on/off current ratio; two-dimensional simulation; Doping; Electric breakdown; Epitaxial layers; P-i-n diodes; Performance analysis; Rectifiers; Schottky barriers; Schottky diodes; Semiconductor device breakdown; Silicon carbide;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2003.813783
  • Filename
    1217255