• DocumentCode
    756733
  • Title

    Lanthanide (Tb)-doped HfO2 for high-density MIM capacitors

  • Author

    Sun Jung Kim ; Byung Jin Cho ; Ming-Fu Li ; Chunxiang Zhu ; Chin, A. ; Dim-Lee Kwong

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
  • Volume
    24
  • Issue
    7
  • fYear
    2003
  • fDate
    7/1/2003 12:00:00 AM
  • Firstpage
    442
  • Lastpage
    444
  • Abstract
    A high-density metal-insulator-metal (MIM) capacitor with a lanthanide-doped HfO2 dielectric prepared by physical vapor deposition (PVD) is presented for the first time. A significant improvement was shown in both the voltage coefficient of capacitance (VCC) and the leakage current density of MIM capacitor, yet the high capacitance density of HfO2 dielectrics was maintained by achieving the doping of Tb with an optimum concentration in HfO2. This technique allows utilizing thinner dielectric film in MIM capacitors and achieving a capacitance density as high as 13.3 fF/μm2 with leakage current and VCC values that fully meet requirements from year 2005 for radio frequency (RF) bypass capacitors applications.
  • Keywords
    MIM devices; capacitors; dielectric thin films; hafnium compounds; leakage currents; sputtered coatings; terbium; HfO/sub 2/:Tb; RF bypass capacitor; Tb-doped HfO/sub 2/ dielectric film; capacitance density; cosputtering; high-K material; high-density MIM capacitor; leakage current density; physical vapor deposition; voltage coefficient of capacitance; Atherosclerosis; Capacitance; Chemical vapor deposition; Dielectrics; Hafnium oxide; Leakage current; MIM capacitors; Metal-insulator structures; Radio frequency; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2003.814024
  • Filename
    1217291