DocumentCode :
757251
Title :
Managing design and test challenges
Volume :
26
Issue :
2
fYear :
2009
Firstpage :
4
Lastpage :
4
Abstract :
Risks are notably increasing in the design of complex SoCs at the 65-nm technology node and beyond. Escalating design costs, increasing profitability and time-to-market pressures, and skyrocketing power consumption—in conjunction with a lower first-silicon success rate, and lower chip manufacturability and reliability—are among the key challenges that chip makers are confronting. To minimize the risks in the face of these challenges requires skillful management of the design process, which has become a core competency of leading chip makers. This issue of Design & Test features a special issue on the management of emerging SoC development. The special issue consists of four articles, contributed by experienced design managers from leading semiconductor companies. In addition, four general-interest articles address diverse design and test issues.
Keywords :
Built-in self-test; Chip scale packaging; Costs; Manufacturing; Process design; Profitability; Risk management; Technology management; Testing; Time to market; SoC development; design and test; design challenges; design management;
fLanguage :
English
Journal_Title :
Design & Test of Computers, IEEE
Publisher :
ieee
ISSN :
0740-7475
Type :
jour
DOI :
10.1109/MDT.2009.40
Filename :
4850402
Link To Document :
بازگشت