• DocumentCode
    75784
  • Title

    Numerical Simulation of Superconducting Coil Wound With No-Insulation NbTi Wire

  • Author

    Noguchi, So ; Itoh, Ryusei ; Seungyong Hahn ; Iwasa, Yukikazu

  • Author_Institution
    Grad. Sch. of Inf. Sci. & Technol., Hokkaido Univ., Sapporo, Japan
  • Volume
    24
  • Issue
    3
  • fYear
    2014
  • fDate
    Jun-14
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A no-insulation winding technique for an NbTi superconducting coil is expected to improve its dynamic stability during charging or discharging. Experimental results, recently reported, demonstrated the charging stability enhancement of an NI coil. In an NI winding, an amount of current can bypass to adjacent wires to avoid the generation of a local hot spot and, as a result, the dynamic stability is improved. In spite of the potential technical merits of the NI technique, the charging responses of an NI coil, including the non-uniform current distribution under a time-varying condition, have not been investigated analytically yet. In this paper, we propose a simulation method using an equivalent circuit equation for an NI coil with its inductance and the contact turn-to-turn resistances taken into consideration. The simulation results were analyzed in three aspects: terminal voltage, loss energy, and stored magnetic energy.
  • Keywords
    niobium alloys; superconducting coils; titanium alloys; winding (process); NbTi; contact turn-to-turn resistances; discharging; dynamic stability; equivalent circuit equation; local hot spot; loss energy; no-insulation niobium titanium wire; no-insulation winding technique; nonuniform current distribution; stored magnetic energy; superconducting coil; terminal voltage; time-varying condition; Coils; Equivalent circuits; Integrated circuit modeling; Magnetic resonance imaging; Nickel; Superconducting magnets; Wires; Circuit equation; dynamic stability; no-insulation coil; superconducting magnet;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2013.2287909
  • Filename
    6651677