Title :
Investigating the thermal response of a micro-optical shutter
Author :
Wong, Chung-Nin Channy ; Graham, Samuel
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fDate :
6/1/2003 12:00:00 AM
Abstract :
The thermal analysis of a fully integrated micro-switch for surety applications will be presented. Specifically, this study focuses on the temperature increase of a micromachined optical shutter with spot heating from a solid-state laser. To analyze the shutter response, a "design-to-analysis" interface has been developed that generates an accurate three-dimensional (3-D) solid geometry from the two-dimensional (2-D) mask layout. By building the "design-to-analysis" interface, engineers can use this solid modeler to virtually prototype and verify a design, and to simulate the performance of micro-devices before fabrication. To determine the effects of thermal conductivity and contact resistance on the thermal response of this passively cooled device, a sensitivity study is also performed.
Keywords :
contact resistance; micro-optics; microswitches; thermal conductivity; thermal management (packaging); MOEMS; contact resistance; micro-optical shutter; micromachined optical shutter; microswitch; sensitivity study; solid-state laser; spot heating; surety applications; thermal conductivity; thermal management; thermal response; three-dimensional solid geometry; two-dimensional mask layout; Geometrical optics; Heating; Microswitches; Optical sensors; Solid lasers; Solid modeling; Temperature; Thermal conductivity; Thermal resistance; Two dimensional displays;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.815095