• DocumentCode
    758178
  • Title

    Investigating the thermal response of a micro-optical shutter

  • Author

    Wong, Chung-Nin Channy ; Graham, Samuel

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • Volume
    26
  • Issue
    2
  • fYear
    2003
  • fDate
    6/1/2003 12:00:00 AM
  • Firstpage
    324
  • Lastpage
    331
  • Abstract
    The thermal analysis of a fully integrated micro-switch for surety applications will be presented. Specifically, this study focuses on the temperature increase of a micromachined optical shutter with spot heating from a solid-state laser. To analyze the shutter response, a "design-to-analysis" interface has been developed that generates an accurate three-dimensional (3-D) solid geometry from the two-dimensional (2-D) mask layout. By building the "design-to-analysis" interface, engineers can use this solid modeler to virtually prototype and verify a design, and to simulate the performance of micro-devices before fabrication. To determine the effects of thermal conductivity and contact resistance on the thermal response of this passively cooled device, a sensitivity study is also performed.
  • Keywords
    contact resistance; micro-optics; microswitches; thermal conductivity; thermal management (packaging); MOEMS; contact resistance; micro-optical shutter; micromachined optical shutter; microswitch; sensitivity study; solid-state laser; spot heating; surety applications; thermal conductivity; thermal management; thermal response; three-dimensional solid geometry; two-dimensional mask layout; Geometrical optics; Heating; Microswitches; Optical sensors; Solid lasers; Solid modeling; Temperature; Thermal conductivity; Thermal resistance; Two dimensional displays;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2003.815095
  • Filename
    1218228