Characterization and modeling of a new via structure in multilayered printed circuit boards

Author

Kwon, Daehan ; Kim, Jaewon ; Kim, KiHyuk ; Choi, SeungChul ; Lim, JuHwan ; Park, Jung-Ho ; Choi, Lynn ; Hwang, Sungwoo ; Lee, SeungHee

Author_Institution

Dept. of Electron. & Comput. Eng., Korea Univ., Seoul, South Korea

Volume

26

Issue

2

fYear

2003

fDate

6/1/2003 12:00:00 AM

Firstpage

483

Lastpage

489

Abstract

We demonstrate that structure engineering of the transmission line near the via can reduce the amount of reflection of the RF signal. We have fabricated two types of vias with different transmission line geometries and have measured the reflection. The measured results show that the shape of the transmission line near the via hole is important in determining the total reflection of the via structure. The amount of reflection obtained from full three-dimensional (3-D) electromagnetic simulations can reproduce the measured results with reasonable accuracy, which suggests that efficient design of the via structure could be possible without resorting to hardware fabrication and characterization.

Keywords

circuit simulation; printed circuit design; transmission lines; RF signal; full three-dimensional electromagnetic simulations; line geometries; multilayered printed circuit boards; structure engineering; total reflection; transmission line; via structure; Capacitance; Distributed parameter circuits; Electromagnetic measurements; Electromagnetic reflection; Geometry; Hardware; Printed circuits; Radio frequency; Shape measurement; Transmission line measurements;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2003.815119

Filename

1218246