DocumentCode
758403
Title
Open forum - Editorial [Semiconductor packages]
Author
Pecht, Michael G.
Author_Institution
University of Maryland
Volume
26
Issue
2
fYear
2003
fDate
6/1/2003 12:00:00 AM
Firstpage
490
Lastpage
491
Keywords
Consumer electronics; Electric resistance; Electronic packaging thermal management; Electronics packaging; Lead; Material storage; Plastics; Semiconductor device manufacture; Semiconductor device packaging; Thermal resistance;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2003.815086
Filename
1218247
Link To Document