Title :
Open forum - Editorial [Semiconductor packages]
Author :
Pecht, Michael G.
Author_Institution :
University of Maryland
fDate :
6/1/2003 12:00:00 AM
Keywords :
Consumer electronics; Electric resistance; Electronic packaging thermal management; Electronics packaging; Lead; Material storage; Plastics; Semiconductor device manufacture; Semiconductor device packaging; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.815086
