DocumentCode :
759958
Title :
A high-sensitivity silicon accelerometer with a folded-electrode structure
Author :
Yazdi, Navid ; Najafi, Khalil ; Salian, Arvind S.
Author_Institution :
Center for Integrated Microsystems, Univ. of Michigan, Ann Arbor, MI, USA
Volume :
12
Issue :
4
fYear :
2003
Firstpage :
479
Lastpage :
486
Abstract :
A high-sensitivity capacitive silicon accelerometer with a new device structure is presented in this paper. The structure uses a fixed rigid electrode suspended between a proof mass and a stiff moving electrode to provide differential capacitance measurement and force rebalancing. High sensitivity is achieved by forming a thick silicon proof mass and a narrow uniform air gap over a large area. The mechanical noise floor is reduced by incorporating damping holes in the electrodes. The accelerometer structure is all silicon and is fabricated on a single silicon wafer. The measured sensitivity for a device with 2.6 mm × 1 mm proof mass and 1.4 μm air gap is ≈11 pF/g per electrode. The calculated mechanical noise floor for the same device is 0.18 μg/√Hz at atmosphere.
Keywords :
accelerometers; capacitive sensors; elemental semiconductors; microelectrodes; micromachining; microsensors; sensitivity; silicon; 1 mm; 1.4 micron; 2.6 mm; Si; bulk micromachining; differential capacitance measurement; electrode damping holes; folded-electrode structure; force rebalancing; high-sensitivity Si accelerometer; mechanical noise floor reduction; microgravity accelerometer; narrow uniform air gap; stiff moving electrode; surface micromachining; suspended fixed rigid electrode; thick Si proof mass; trench refill; vertical stiffener; Accelerometers; Acoustic measurements; Atmosphere; Bandwidth; Damping; Electrodes; Noise reduction; Seismic measurements; Silicon; Wafer bonding;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2003.815837
Filename :
1219516
Link To Document :
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