Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials

Author

Tong, Tao ; Zhao, Yang ; Delzeit, Lance ; Kashani, Ali ; Meyyappan, M. ; Majumdar, Arun

Author_Institution

Dept. of Mech. Eng., California Univ., Berkeley, CA

Volume

30

Issue

1

fYear

2007

fDate

3/1/2007 12:00:00 AM

Firstpage

92

Lastpage

100

Abstract

Carbon nanotube (CNT) arrays are being considered as thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance technique, we measure the thermal conductance of the two interfaces on each side of a vertically aligned CNT array as well as the CNT array itself. We show that the physically bonded interface by van der Waals adhesion has a conductance ~10⁵W/m²K and is the dominant resistance. We also demonstrate that by bonding the free-end CNT tips to a target surface with the help of a thin layer of indium weld, the conductance can be increased to ~10⁶W/m²K making it attractive as a TIM

Keywords

adhesion; carbon nanotubes; thermal conductivity; thermoreflectance; van der Waals forces; dense vertically aligned carbon nanotube arrays; multiwalled carbon nanotube arrays; phase sensitive transient thermoreflectance technique; thermal conductance; thermal interface materials; van der Waals adhesion; Adhesives; Bonding; Carbon nanotubes; Conducting materials; Indium; Organic materials; Phase measurement; Phased arrays; Surface resistance; Thermal conductivity; Carbon nanotube (CNT); multiwalled; thermal interface material (TIM); thermo-reflectance;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2007.892079

Filename

4142686