• DocumentCode
    76272
  • Title

    Modeling of SiC IGBT Turn-Off Behavior Valid for Over 5-kV Circuit Simulation

  • Author

    Miyake, M. ; Ueno, Masahiro ; Feldmann, Uwe ; Mattausch, Hans Jurgen

  • Author_Institution
    Hiroshima Univ., Higashi-Hiroshima, Japan
  • Volume
    60
  • Issue
    2
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    622
  • Lastpage
    629
  • Abstract
    This paper presents a compact model of SiC insulated-gate bipolar transistors (IGBTs) for power electronic circuit simulation. Here, we focus on the modeling of important specific features in the turn-off characteristics of the 4H-SiC IGBT, which are investigated with a 2-D device simulator, at supply voltages higher than 5 kV. These features are found to originate from the punch-through effect of the SiC IGBT. Thus, they are modeled based on the carrier distribution change caused by punch through and implemented into the silicon IGBT model named “HiSIM-IGBT” to obtain a practically useful SiC-IGBT model. The developed compact SiC-IGBT model for circuit simulation is verified with the 2-D device simulation data.
  • Keywords
    circuit simulation; insulated gate bipolar transistors; power bipolar transistors; semiconductor device models; silicon compounds; wide band gap semiconductors; 2D device simulation data; 2D device simulator; HiSIM-IGBT; IGBT turn-off behavior modelling; SiC; carrier distribution; insulated-gate bipolar transistors; power electronic circuit simulation; punch-through effect; silicon IGBT model; Charge carrier density; Insulated gate bipolar transistors; Integrated circuit modeling; Mathematical model; Semiconductor device modeling; Silicon; Silicon carbide; Circuit simulation; HiSIM; IGBT; SPICE; SiC; compact model; punch through;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2012.2226182
  • Filename
    6361470