Title :
Concave-Suspended High-Q Solenoid Inductors With an RFIC-Compatible Bulk-Micromachining Technology
Author :
Gu, Lei ; Li, Xinxin
Author_Institution :
Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai
fDate :
4/1/2007 12:00:00 AM
Abstract :
Presented in this brief is a concave-suspended solenoid inductor that can be post-CMOS integrated into a low-resistivity silicon substrate using a novel radio frequency integrated circuit (RFIC)-compatible micromachining technology. The three-mask processes include photoresist spray coating, XeF2 gaseous etching and copper electroplating, etc. The fabricated 11.5-turn inductor is measured with 2.96-nH inductance at 5.35 GHz, where the peak Q-factor is as high as about 45. Even with a compact layout (50% area occupation saved), the 8.5-turn inductor is still measured with 2.78 nH and peak Q of about 28 at 4.90 GHz. Both finite element simulation and shock testing results show that the suspended inductor is almost free of influence from environmental vibration and shock. Featuring high-Q performance and robust properties, the RFIC-compatible inductors are promising for high-performance RFIC applications
Keywords :
CMOS integrated circuits; Q-factor; elemental semiconductors; finite element analysis; inductors; micromachining; radiofrequency integrated circuits; silicon; xenon compounds; 4.90 GHz; 5.35 GHz; CMOS; Q-factor; RFIC-compatible bulk-micromachining technology; RFIC-compatible inductors; Si; XeF2; concave-suspended high-Q solenoid inductors; copper electroplating; environmental shock; environmental vibration; finite element simulation; gaseous etching; inductor; photoresist spray coating; radio frequency integrated circuit; shock testing; silicon substrate; Coatings; Electric shock; Inductors; Integrated circuit technology; Micromachining; Radiofrequency integrated circuits; Resists; Silicon; Solenoids; Spraying; $Q$- factor; Bulk micromachining; radio frequency integrated circuit (RFIC); solenoid inductors;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2007.892362