DocumentCode :
762860
Title :
Dependence of Device Structures on Latchup Immunity in a High-Voltage 40-V CMOS Process With Drain-Extended MOSFETs
Author :
Hsu, Sheng-Fu ; Ker, Ming-Dou
Author_Institution :
Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu
Volume :
54
Issue :
4
fYear :
2007
fDate :
4/1/2007 12:00:00 AM
Firstpage :
840
Lastpage :
851
Abstract :
The dependence of device structures on latchup immunity in a 0.25-mum high-voltage (HV) 40-V CMOS process with drain-extended MOS (DEMOS) transistors has been verified with silicon test chips and investigated with device simulation. Layout parameters such as anode-to-cathode spacing and guard ring width are also investigated to find their impacts on latchup immunity. It was demonstrated that the drain-extended NMOS with a specific isolated device structure can greatly enhance the latchup immunity. The proposed test structures and simulation methodologies can be applied to extract safe and compact design rule for latchup prevention of DEMOS transistors in HV CMOS process
Keywords :
CMOS integrated circuits; MOSFET; elemental semiconductors; silicon; 0.25 micron; 40 V; CMOS process; MOS transistors; Si; device simulation; device structures dependence; drain-extended MOSFET; latchup immunity; silicon test chips; silicon-controlled rectifier; transmission line pulsing; CMOS process; CMOS technology; Circuits; Immune system; MOSFETs; Rectifiers; Silicon; Thyristors; Transistors; Voltage; Drain-extended MOS (DEMOS); high-voltage (HV) CMOS process; l atchup; silicon-controlled rectifier (SCR); transmission line pulsing (TLP);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2007.892013
Filename :
4142883
Link To Document :
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