Title :
A fully compensated active pull-down ECL circuit with self-adjusting driving capability
Author :
Ueda, Kimio ; Sasaki, Nagisa ; Sato, Hisayasu ; Mashiko, Koichiro
Author_Institution :
System LSI Lab., Mitsubishi Electr. Corp., Hyogo, Japan
fDate :
1/1/1996 12:00:00 AM
Abstract :
A new active pull-down emitter-coupled logic (ECL) circuit having full compensation against fluctuations in supply voltage and temperature is proposed. This circuit needs no capacitors but a feed-back circuit to adjust its pull-down capability to its load capacitance. The speed performance is compared between the active pull-down ECL circuit and the conventional ECL circuit using 0.8 μm SPICE parameters. The active pull-down ECL circuit is twice as fast as the conventional ECL circuit under the load capacitance of 0.8 pF with the same power dissipation. The relation between the power dissipation and the operating frequency is compared among the CMOS, the conventional ECL, and the active pull-down ECL circuits. The comparison adapts a new method in which the circuit parameters are optimized at each operating frequency. The SPICE simulation using this new method shows the conventional ECL circuit has a lower power dissipation than the CMOS circuit, even in the low operating frequency region of 100 MHz. The new active pull-down ECL circuit has the lowest power dissipation among the three circuits. The power dissipation of this circuit shows 47% lower than the CMOS circuit and 29% lower than the conventional ECL circuit at the operating frequency of 600 MHz and the load capacitance of 0.8 pF
Keywords :
SPICE; bipolar logic circuits; circuit analysis computing; circuit feedback; compensation; emitter-coupled logic; network parameters; 0.8 micron; 0.8 pF; 100 to 600 MHz; SPICE parameters; active pull-down ECL circuit; circuit parameters; compensation; feedback circuit; load capacitance; operating frequency; power dissipation; self-adjusting driving capability; Capacitance; Capacitors; Circuit simulation; Frequency; Logic circuits; Optimization methods; Power dissipation; SPICE; Temperature; Voltage fluctuations;
Journal_Title :
Solid-State Circuits, IEEE Journal of