Development of new low stress epoxies for MEMS device encapsulation

In this study, a series of new low stress epoxies was introduced as conformal encapsulants, which show a high promise to meet all the requirements for the protection of the pressure sensor system. Mechanical properties such as initial Young´s modulus, toughness and ultimate tensile stress were evaluated. The more critical issue of material´s contamination resistance to the jet fuel was improved. And the mechanism behind materials low stress and toughness behaviors was investigated from the viewpoint of microstructure