Development of new low stress epoxies for MEMS device encapsulation

Author

Wu, Jiali ; Wong, C.P.

Author_Institution

Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

25

Issue

2

fYear

2002

fDate

6/1/2002 12:00:00 AM

Firstpage

278

Lastpage

282

Abstract

In this study, a series of new low stress epoxies was introduced as conformal encapsulants, which show a high promise to meet all the requirements for the protection of the pressure sensor system. Mechanical properties such as initial Young´s modulus, toughness and ultimate tensile stress were evaluated. The more critical issue of material´s contamination resistance to the jet fuel was improved. And the mechanism behind materials low stress and toughness behaviors was investigated from the viewpoint of microstructure

Keywords

Young´s modulus; encapsulation; fracture toughness; internal stresses; microsensors; polymers; pressure sensors; tensile strength; MEMS device encapsulation; Young´s modulus; conformal encapsulant; contamination resistance; jet fuel; low stress epoxy; mechanical properties; microstructure; pressure sensor; toughness; ultimate tensile stress; Aerospace materials; Coatings; Contamination; Encapsulation; Fuels; Microelectromechanical devices; Micromechanical devices; Packaging; Protection; Tensile stress;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2002.1010018

Filename

1010018