A simple model for the Mode I popcorn effect for IC packages with copper leadframe

Author

Alpern, Peter ; Lee, Kheng Chooi ; Dudek, Rainer ; Tilgner, Rainer

Author_Institution

Infineon Technol. AG, Munich, Germany

Volume

25

Issue

2

fYear

2002

fDate

6/1/2002 12:00:00 AM

Firstpage

301

Lastpage

308

Abstract

A simple model for the Mode I popcorn effect is presented here for packages with rectangular die pads (P-DSO). A package "stability parameter," relating to its moisture sensitivity, is derived from the popcorn model. It describes the critical factors for a robust package-molding compound properties and package, leadframe design for a given preconditioning and soldering process. Furthermore, nomograms generated from the model facilitate an easy estimation of moisture sensitivity levels (between 1 and 5) of packages with different die pad sizes and molding compound underpad thicknesses and for different soldering temperatures ranging from 220°C to 260°C (lead-free soldering)

Keywords

copper; environmental degradation; integrated circuit packaging; moisture; moulding; nomograms; soldering; 220 to 260 C; Cu; IC package; Mode I popcorn model; P-DSO; copper leadframe; moisture sensitivity; molding compound; nomogram; preconditioning process; rectangular die pad; soldering process; stability parameter; Environmentally friendly manufacturing techniques; Integrated circuit modeling; Integrated circuit packaging; Lead; Moisture; Robustness; Soldering; Stability; Temperature distribution; Temperature sensors;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2002.1010021

Filename

1010021