Title :
Development of self-packaged high frequency circuits using micromachining techniques
Author :
Drayton, Rhonda Franklin ; Katehi, L.P.B.
Author_Institution :
Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA
fDate :
9/1/1995 12:00:00 AM
Abstract :
A new concept for packaging high frequency monolithic circuits is presented. It consists of developing miniaturized housings to shield individual passive components (e.g., CPW based), active elements, or combinations of them by employing silicon micromachining technology. At high frequencies, self-packaged configurations that are fabricated in this manner provide reduction in the overall size and weight of a circuit and provide increased isolation between neighboring circuits. Therefore, the resulting characteristics make these micropackaged components appropriate for high density, multilevel interconnect circuits. This paper will describe the fabrication procedures used to develop self-packaged components. Performance curves for typical high frequency circuit geometries that are implemented in this configuration are shown for measured and theoretical results
Keywords :
MMIC; coplanar waveguides; electromagnetic shielding; integrated circuit interconnections; integrated circuit packaging; micromachining; CPW based elements; circuit geometries; isolation; micromachining techniques; micropackaged components; miniaturized housings; monolithic circuits; multilevel interconnect circuits; planar transmission lines; self-packaged high frequency circuits; shielding; Circuit synthesis; Coplanar waveguides; Fabrication; Frequency; Geometry; Micromachining; Millimeter wave technology; Packaging; RLC circuits; Silicon;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on