Title :
Self-aligned packing of an optical switch array with integrated tapers
Author :
Acklin, B. ; Bellermann, J. ; Schienle, M. ; Stoll, L. ; Honsberg, M. ; Muller, G.
Author_Institution :
Siemens AG, Munich, Germany
fDate :
4/1/1995 12:00:00 AM
Abstract :
An array of 2/spl times/2 switches with integrated tapers has been pigtailed using a silicon submount to self-align both chip and single-mode fibers. Electrical contacts were wirebonded through an opening etched in the submount. We report fiber-to-fiber insertion loss below 10 dB and measurements of wavelength and temperature dependence of the module.<>
Keywords :
etching; integrated optics; optical fabrication; optical switches; packaging; wafer bonding; 10 dB; 2/spl times/2 switch array; chip; electrical contacts; etched; fiber-to-fiber insertion loss; integrated tapers; optical switch array; pigtailed; self-align; self-aligned packing; silicon submount; single-mode fibers; temperature dependence; wirebonded; Contacts; Etching; Insertion loss; Loss measurement; Optical arrays; Optical fiber losses; Optical switches; Semiconductor device measurement; Silicon; Wavelength measurement;
Journal_Title :
Photonics Technology Letters, IEEE
