Optimum Design of Copper Stabilizer on Coated Conductors

Metallic copper is the obvious engineering stabilizing partner for the second-generation coated conductor (CC) wire. The copper shunt on the conductor gives a number of electric, thermal, and mechanical advantages. Nonvacuum deposition of copper by electrochemical plating is now an established CC technology, both single sided as well as surrounded. Cu plating on RABITS Ag/YBCO/Ni5%W and IBAD Ag/YBCO/YSZ/Hastelloy conductors are reported in the applied cell potentials, currents, and Coulombs. The diffusion-limited plating current in copper sulfate and alkaline electrolyte is investigated in view of the largest rate of mass transfer. The electrochemical deposition opens a further window of design and conductor engineering. Beneficial Cu plating with Ag cap layer is performed, and J_c is evaluated. All parameters are transferred into the reel technique to improve the efficiency of copper plating. This paper describes the optimum and merits of Cu shunt parameters in geometry, thickness, and wire robustness.