Packaging of a 128 by 128 liquid-crystal-on-silicon spatial light modulator using self-pulling soldering

Author

Ju, T.H. ; Lin, W. ; Lee, Y.C. ; McKnight, D.J. ; Johnson, K.M.

Author_Institution

Optoelectron. Comput. Syst. Center, Colorado Univ., Boulder, CO, USA

Volume

7

Issue

9

fYear

1995

Firstpage

1010

Lastpage

1012

Abstract

A self-pulling soldering technology has been demonstrated for assembling liquid crystal on silicon (LCOS) spatial light modulators (SLMs). Solder joints with different profiles and sizes are designed to provide vertical surface tension forces to control the gap accommodating the ferroelectric liquid crystal (FLC) layer in the range of a micron with sub-micron uniformity. This technology provides an automatic, batch assembly process for a LCOS SLM through one reflow process. The component designs and process optimization are described, and the first operational results are presented.<>

Keywords

ferroelectric liquid crystals; liquid crystal devices; optical fabrication; optical films; optimisation; packaging; soldering; spatial light modulators; surface tension; Si; batch assembly process; ferroelectric liquid crystal layer; liquid-crystal-on-silicon spatial light modulator; operational results; packaging; process optimization; self-pulling soldering; solder joints; sub-micron uniformity; vertical surface tension forces; Assembly; Automatic control; Ferroelectric materials; Force control; Liquid crystal on silicon; Optical modulation; Packaging; Size control; Soldering; Surface tension;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/68.414685

Filename

414685