DocumentCode :
766152
Title :
A comparison of two micromachined inductors (bar- and meander-type) for fully integrated boost DC/DC power converters
Author :
Ahn, Chong H. ; Allen, Mark G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
Volume :
11
Issue :
2
fYear :
1996
fDate :
3/1/1996 12:00:00 AM
Firstpage :
239
Lastpage :
245
Abstract :
Two micromachined integrated inductors (bar- and meander-type) are realized on a silicon wafer by using modified, IC-compatible, multilevel metallization techniques. Efforts are made to minimize both the coil resistance and the magnetic reluctance by using thick electroplated conductors, cores, and vias. In the bar-type inductor, a 25-μm thick nickel-iron permalloy magnetic core bar is wrapped with 30-μm thick multilevel copper conductor lines. For an inductor size of 4 mm×1.0 mm×110 μm thickness having 33 turns of multilevel coils, the achieved specific inductance is approximately 30 nH/mm2 at 1 MHz. In the meander-type inductor, the roles of conductor wire and magnetic core are switched, i.e., a magnetic core is wrapped around a conductor wire. This inductor size is 4 mm×1.0 mm×130 μm and consists of 30 turns of a 35-μm thick nickel-iron permalloy magnetic core around a 10-μm thick sputtered aluminum conductor lines. A specific inductance of 35 nH/mm2 is achieved at a frequency of 1 MHz. Using these two inductors, switched DC/DC boost converters are demonstrated in a hybrid fashion. The obtained maximum output voltage is approximately double an input voltage of 3 V at switching frequencies of 300 kHz and a duty cycle of 50% for both inductors, demonstrating the usefulness of these integrated planar inductors
Keywords :
DC-DC power convertors; Permalloy; aluminium; coils; conductors (electric); copper; electroplated coatings; inductors; magnetic cores; metallisation; micromachining; switching circuits; 1 MHz; 1 mm; 25 to 130 mum; 3 V; 300 kHz; 4 mm; Al; Cu; NiFe; bar-type inductor; coil resistance minimisation; integrated boost DC/DC power converters; integrated planar inductors; magnetic reluctance minimisation; meander-type inductor; micromachined inductors; multilevel copper conductor lines; multilevel metallization techniques; nickel-iron permalloy magnetic core; silicon wafer; sputtered aluminum conductor lines; switching frequencies; thick electroplated conductors; thick electroplated cores; thick electroplated vias; Coils; Conductors; Copper; Inductance; Inductors; Magnetic cores; Metallization; Silicon; Voltage; Wire;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/63.486171
Filename :
486171
Link To Document :
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