DocumentCode
766171
Title
An optical backplane demonstrator system based on FET-SEED smart pixel arrays and diffractive lenslet arrays
Author
Plant, D.V. ; Robertson, B. ; Hinton, H.S. ; Robertson, W.M. ; Boisset, G.C. ; Kim, N.H. ; Liu, Y.S. ; Otazo, M.R. ; Rolston, D.R. ; Shang, A.Z.
Author_Institution
Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
Volume
7
Issue
9
fYear
1995
Firstpage
1057
Lastpage
1059
Abstract
We have demonstrated a representative portion of an optical backplane using FET-SEED smart pixels and free-space optics to interconnect printed circuit boards (PCB´s) in a two board, unidirectional link configuration. 4/spl times/4 arrays of FET-SEED transceivers were designed, fabricated, and packaged all the PCB level, The optical interconnection was constructed using diffractive microoptics, and custom optomechanics. The system was operated in two modes, one showing high data throughput, 100 MBit/sec, and the other demonstrating large connection densities, 2222 channel/cm/sup 2/.<>
Keywords
SEEDs; asynchronous transfer mode; field effect integrated circuits; integrated optoelectronics; optical computing; optical interconnections; optical receivers; photonic switching systems; printed circuits; smart pixels; transceivers; 100 Mbit/s; 4/spl times/4 arrays; FET-SEED smart pixel arrays; FET-SEED transceivers; PCB level; custom optomechanics; design; diffractive microoptics; fabrication; free-space optics; high data throughput; large connection densities; optical backplane; optical backplane demonstrator system; optical interconnection; package; printed circuit boards; unidirectional link configuration; Backplanes; Integrated circuit interconnections; Optical arrays; Optical design; Optical diffraction; Optical interconnections; Packaging; Printed circuits; Smart pixels; Transceivers;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/68.414702
Filename
414702
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