• DocumentCode
    766691
  • Title

    A novel method for the fabrication of high-aspect ratio C-MEMS structures

  • Author

    Wang, Chunlei ; Jia, Guangyao ; Taherabadi, Lili H. ; Madou, Marc J.

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Univ. of California, Irvine, CA, USA
  • Volume
    14
  • Issue
    2
  • fYear
    2005
  • fDate
    4/1/2005 12:00:00 AM
  • Firstpage
    348
  • Lastpage
    358
  • Abstract
    A novel fabrication process was developed to create high aspect ratio (>10:1) carbon posts, all-carbon suspended bridges and wires, self-organized bunches of carbon posts, and carbon plates supported by carbon beams. The structures are all made from a two-step pyrolysis process with SU-8 photoresist as the starting material. In this paper we describe the fabrication of these various new C-MEMS structures and detail an important application of the high aspect ratio carbon posts arrays. The carbon post arrays can be reversible charged/discharged with Li ions, an application that may greatly impact the application of C-MEMS in three-dimensional microbatteries. Complex suspended C-MEMS structures, such as wires, plates, ribbons, and self-organized bunches of posts, were built. Methods to accurately and repeatedly fabricate all the above 3-D C-MEMS structures are given.
  • Keywords
    arrays; carbon; lithium; micromechanical devices; photoresists; pyrolysis; shapes (structures); 3D C-MEMS structures; C; Li; Li intercalation; Li ions; MEMS fabrication; SU-8 photoresist; carbon beams; carbon plates; carbon post arrays; complex microelectromechanical systems; high-aspect ratio; microbattery; reversible charging; reversible discharging; suspended structure; two-step pyrolysis process; Biological materials; Chemicals; Crystalline materials; Diamond-like carbon; Fabrication; Organic materials; Printing; Resists; Sensor arrays; Wires; Complex microelectromechanical systems (C-MEMS); Li intercalation; high-aspect ratio; microbattery; photoresist; pyrolysis; suspended structure;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2004.839312
  • Filename
    1416911