Title :
Junction Thermal Impedance Measurement of Superluminescent Diodes
Author :
Zhou, Sheng ; Zhang, Xiupu
Author_Institution :
Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que.
fDate :
5/1/2007 12:00:00 AM
Abstract :
A new method is presented for junction thermal impedance measurement of superluminescent diodes. A few derivatives of mean wavelength, optical power, and voltage over temperature and current are used for the calculation. Carrier effect is removed. High accuracy is obtained by data regression on variables separately. Both analytical formula and experimental results are provided
Keywords :
superluminescent diodes; data regression; junction thermal impedance measurement; mean wavelength derivatives; superluminescent diodes; thermal impedance; Impedance measurement; Power generation; Pulse measurements; Semiconductor device measurement; Semiconductor device packaging; Stimulated emission; Superluminescent diodes; Temperature; Voltage; Wavelength measurement; Mean wavelength; measurement; superluminescent diodes (SLDs); thermal impedance;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2007.895051
