DocumentCode
767999
Title
High frequency measurement of multilayer ceramic capacitors
Author
Sakabe, Yukio ; Hayashi, Masami ; Ozaki, Takefumi ; Canner, James P.
Author_Institution
Murata Manuf. Co. Ltd., Nagaokakyo, Japan
Volume
19
Issue
1
fYear
1996
fDate
2/1/1996 12:00:00 AM
Firstpage
7
Lastpage
14
Abstract
The monolithic ceramic capacitor (MLC) is small and has good high frequency performance. It is used in various high frequency circuits for impedance matching, DC block, filter and bypass functions. For the best performance in these applications, low equivalent series resistance (ESR) and equivalent series inductance (ESL) is required. We have developed the testing method to compare the performance of different MLC designs to find out the effect on the ESR and ESL. In order to measure the high frequency performance accurately, we have developed a test fixture using the microstrip design. The fixture has a return loss of greater than 30 dB and the insertion loss is less than 0.5 dB. The MLC is mounted on the microstrip fixture and the return loss (RL) and the insertion loss (IL) is measured. A network analyzer is used to compensate for the fixture to obtain good data up to 15 GHz. Using this method, we compare two designs for microwave power applications and two designs for high speed digital applications. We have developed the ultra small capacitor that has good performance in high speed digital circuits
Keywords
ceramic capacitors; electron device testing; equivalent circuits; microwave measurement; 0.5 dB; 15 GHz; 30 dB; DC blocking; MLC; bypass function; equivalent series inductance; equivalent series resistance; filtering; high frequency measurement; high speed digital circuits; impedance matching; insertion loss; microstrip test fixture; microwave power applications; monolithic ceramic capacitor; multilayer ceramic capacitor; network analyzer; return loss; ultra small capacitor; Capacitors; Ceramics; Circuits; Fixtures; Frequency measurement; Impedance matching; Insertion loss; Microstrip; Nonhomogeneous media; Paramagnetic resonance;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.486477
Filename
486477
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