DocumentCode :
768015
Title :
A simultaneous switching noise design algorithm for leadframe packages with or without ground plane
Author :
Huang, Chao ; Yang, Yaochao ; Prince, John L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume :
19
Issue :
1
fYear :
1996
fDate :
2/1/1996 12:00:00 AM
Firstpage :
15
Lastpage :
22
Abstract :
This paper provides design techniques for leadframe packages with or without a ground plane, which enable an accurate estimate of the maximum simultaneous switching noise (SSN) and the required numbers of power and/or ground pins for prespecified SSN limits early in the design phase. Two heuristic design approaches, namely equal-angle and quarter-plane, are proposed as initial design choices for the leadframe design to meet prespecified SSN constraint. Effects of the signal conductors in reducing the effective inductance of a leadframe package are quantified. Closed-form equations and SPICE simulation are used to calculate the simultaneous switching noise. A design example for a 28×28 mm plastic quad flat package (PQFP) is given to provide guidelines for SSN-constrained design. The design algorithm is integrated into a CAD tool, UASSNS3.0, which is capable of initial SSN design of leadframe packages
Keywords :
CAD; SPICE; integrated circuit noise; integrated circuit packaging; plastic packaging; CAD tool; SPICE simulation; UASSNS3.0; closed-form equations; design algorithm; equal-angle design; ground pins; ground plane; inductance; leadframe packages; plastic quad flat package; power pins; quarter-plane design; signal conductors; simultaneous switching noise; Algorithm design and analysis; Conductors; Equations; Inductance; Packaging; Phase estimation; Phase noise; Pins; Plastics; SPICE;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.486478
Filename :
486478
Link To Document :
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