DocumentCode :
768035
Title :
A novel method of measuring microelectronic interconnect transmission line parameters and discontinuity equivalent electrical parameters using multiple reflections
Author :
Abernethy, Charles E. ; Cangellaris, Andreas C. ; Prince, John L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume :
19
Issue :
1
fYear :
1996
fDate :
2/1/1996 12:00:00 AM
Firstpage :
32
Lastpage :
39
Abstract :
This paper describes a novel technique which measures the electrical properties of transmission lines (such as microstrip) and extracts equivalent electrical parameters for discontinuities in transmission lines with remarkable precision using a modern network analyzer and newly developed de-embedding software. This technique has successfully measured the per-unit-length inductance (L´), resistance (R´), capacitance (C´), and dielectric loss conductance (G´) of microstrip transmission lines made from solid copper and conductive polymer. These materials have been studied at frequencies up to 201 MHz, and higher frequencies are possible. Discontinuities, such as an opening in the ground plane under the microstrip, have also been characterized at frequencies up to 2400 MHz. Measurements of characteristic impedances and skin resistances made by this method are in agreement with theoretical models. Higher frequency measurements should be feasible using a higher frequency network analyzer
Keywords :
equivalent circuits; high-frequency transmission line measurement; integrated circuit interconnections; integrated circuit measurement; microstrip discontinuities; microwave reflectometry; 201 MHz; 2400 MHz; Cu; capacitance; characteristic impedance; conductive polymer; de-embedding software; dielectric loss conductance; discontinuity equivalent electrical parameters; electrical properties; ground plane; inductance; measurement; microelectronic interconnects; microstrip; multiple reflections; network analyzer; resistance; skin resistance; solid copper; transmission line parameters; Dielectric loss measurement; Dielectric measurements; Electric variables measurement; Electrical resistance measurement; Frequency; Microelectronics; Microstrip; Transmission line discontinuities; Transmission line measurements; Transmission line theory;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.486480
Filename :
486480
Link To Document :
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