Title :
Time-domain characterization and circuit modeling of a multilayer ceramic package
Author :
Jong, Jyh-Ming ; Janko, Bozidar ; Tripath, Vijai K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
fDate :
2/1/1996 12:00:00 AM
Abstract :
The dynamic deconvolution (peeling algorithm) used in the past for single interconnects is extended to multiple-coupled interconnects and used to model high-speed electronic packages. A multilayer ceramic package (MLC) is used as vehicle to demonstrate the characterization and equivalent circuit modeling procedure based on single and multiport time-domain measurement
Keywords :
deconvolution; equivalent circuits; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; multiport networks; time-domain analysis; dynamic deconvolution; equivalent circuit modeling; high-speed electronic package; multilayer ceramic package; multiple-coupled interconnects; multiport time-domain measurement; peeling algorithm; Ceramics; Deconvolution; Electronics packaging; Heuristic algorithms; High-speed electronics; Integrated circuit interconnections; Nonhomogeneous media; Time domain analysis; Vehicle dynamics; Vehicles;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
