Title :
Efficient transient simulation of lossy packaging interconnects using moment-matching techniques
Author :
Celik, Mustafa ; Cangellaris, Andreas C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fDate :
2/1/1996 12:00:00 AM
Abstract :
This paper introduces enhancements to moment-matching techniques for rapid time-domain computer simulation of packaging interconnect structures. New moment calculating methods are proposed to handle dispersive, lossy interconnects and related package discontinuities, transitions and junctions that are modeled in terms of either numerically extracted or measured frequency-dependent, equivalent transmission line parameters, or scattering parameters. Computer simulations of pulse propagation in interconnects with frequency-dependent ohmic losses are used to demonstrate the validity and accuracy of the proposed methods
Keywords :
S-parameters; circuit analysis computing; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; method of moments; transient analysis; discontinuities; dispersive lossy packaging interconnects; frequency-dependent equivalent transmission line parameters; junctions; moment-matching techniques; ohmic losses; pulse propagation; scattering parameters; time-domain computer simulation; transient simulation; transitions; Computational modeling; Computer simulation; Dispersion; Frequency; Packaging; Power system transients; Propagation losses; Time domain analysis; Transmission line discontinuities; Transmission line measurements;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on