Title :
Temperature and stress time history responses in electronic packaging
Author_Institution :
Express Packaging Syst. Inc., Palo Alto, CA, USA
fDate :
2/1/1996 12:00:00 AM
Abstract :
The closed-form thermoelasticity solutions of electronic packages subjected to an instantaneous source of heat, and a heat source varying harmonically as function of time, are presented. Useful curves and charts which relate the variables, time, frequency, heat, temperature, stress, displacement, and material property are also provided for engineering practice convenience. Also, the present results can be used to verify finite element analysis procedures and interpret experimental data
Keywords :
deformation; finite element analysis; packaging; thermal analysis; thermal stresses; thermoelasticity; closed-form thermoelasticity solutions; displacement; electronic packaging; finite element analysis; frequency; heat; material property; stress time history response; temperature; time; Electronic packaging thermal management; Electronics packaging; Frequency; History; Poisson equations; Space heating; Temperature distribution; Thermal conductivity; Thermal force; Thermal stresses;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
