DocumentCode :
768892
Title :
Foreword Thermal Design and Analysis
Author :
Fitch, J.S.
Volume :
19
Issue :
1
fYear :
1996
fDate :
3/1/1996 12:00:00 AM
Firstpage :
45
Keywords :
Components, packaging, and manufacturing technology; Electronic components; Electronic packaging thermal management; Electronics packaging; Grid computing; Manufacturing processes; Optical design; Packaging machines; Plastics; Springs;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/TCPMA.1996.486561
Filename :
486561
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=768892
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