• DocumentCode
    768892
  • Title

    Foreword Thermal Design and Analysis

  • Author

    Fitch, J.S.

  • Volume
    19
  • Issue
    1
  • fYear
    1996
  • fDate
    3/1/1996 12:00:00 AM
  • Firstpage
    45
  • Keywords
    Components, packaging, and manufacturing technology; Electronic components; Electronic packaging thermal management; Electronics packaging; Grid computing; Manufacturing processes; Optical design; Packaging machines; Plastics; Springs;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/TCPMA.1996.486561
  • Filename
    486561
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=768892